Technology

Optiviva develops MEMS based industrial products including optical components, microsensors, and accelerometers. Optiviva owns multiple intellectual properties covering design,manufacturing and packaging in the areas of MEMS process, and MEMS design for optical networking. Those technologies have proven performance, robustness and manufacturability. Based on well-established micro-fabrication technology,unique packaging and manufacturing, Optiviva's optical MEMS components exceed industry norm for performance,compactness, manufacturability and reliability.

　　Optiviva Technology

　　Optiviva Manufacturing

　　Reflective MEMS

　　Wafer Bonding Technology

Optiviva Technology     

Optiviva develops MEMS based industrial products including optical components, microsensors and accelerometers. Optiviva owns multiple intellectual properties covering design,manufacturing and packaging in the areas of the MEMS process as well as in design for optical networking.These technologies have proven performance, robustness and manufacturability. Based on well-established micro-fabrication technology, unique packaging and manufacturing,

Optiviva's optical MEMS components exceed industry norms for performance, compactness, manufacturability,and reliability.

Optiviva has proprietary technologies and patented processes in MEMS application design and fabrication. We are tailoring mature MEMS solutions to best fit the volume manufacturing,  high-reliability, and high-sensitivity characters of the opticalworld.

Optiviva also has patented miniature photonic packaging solutions that will lead in the low-cost, low-profile requirements of optical metro networks and beyond.

Additionally, Optiviva has proprietary technologies in laser welding, planar lightwave circuits (PLCs),alignment,and packaging. Our technologies foster high-yield, high-reliability manufacturing for optical lasers and PLCs.

With manufacturing and engineering services in San Jose,California, and in the most technologically sophisticated region of China, we are well positioned to provide competitive products for the photonics, biomedical, automotive and other industries.


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Optiviva Manufacturing 

Manufacturability has been the most important criterion for the launch of successful MEMS based products. Due to their unique design and packaging, Optiviva's products have superior manufacturability. With in-house design and packaging located in China, combined with outsourced MEMS chip manufacturing from well-known MEMS foundries,

Optiviva has a flexible product development scheme, focusing efforts on chip design and low cost packaging. We use the most advanced MEMS chip manufacturing technologies while relieving you of the burden of maintaining high cost chip manufacturing facilities

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Wafer Bonding Technology 

Wafer to wafer bonding is almost an intrinsic process in MEMS manufacturing technologies. Optiviva's proprietary low temperature wafer to wafer bonding technology has demonstrated its robustness and compatibility with CMOS process. The bonding process can be carried out below 200 degree C and has been successfully used in manufacturing many MEMS devices from optical MEMS, pressure sensors, to accelerometers. The low temperature bonding is pertinent in developing most optical MEMS devices as mirror metal process and suspension characteristics could not tolerate high temperatures. Its low temperature requirement offers flexibility, versatility and simplicity in different MEMS manufacturing processes, which would be required in a broad range of MEMS device fabrications.

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